Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10914018 | Porous Cu on Cu surface for semiconductor packages | Norbert Pielmeier, Chin Yung Lai, Swee Kah Lee, Muhammad Muhammat Sanusi, Evelyn Napetschnig +1 more | 2021-02-09 |
| 10840172 | Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package | Thomas Bemmerl, Azlina Kassim | 2020-11-17 |
| 10777536 | Semiconductor package with air cavity | Chau Fatt Chiang, April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin +8 more | 2020-09-15 |
| 10770399 | Semiconductor package having a filled conductive cavity | Chee Yang Ng, Hock Siang Chua, Stefan Macheiner, Josef Maerz, Joseph Victor Soosai Prakasam +1 more | 2020-09-08 |