Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862541 | Molded semiconductor package having a negative standoff | Thomas Stoek, Dirk Ahlers | 2024-01-02 |
| 11569196 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Chau Fatt Chiang, Wae Chet Yong | 2023-01-31 |
| 11469161 | Lead frame-based semiconductor package | Thorsten Scharf, Chan Lam Cha, Wolfgang Hetzel, Swee Kah Lee | 2022-10-11 |
| 11342252 | Leadframe leads having fully plated end faces | Markus Dinkel | 2022-05-24 |
| 11145578 | Semiconductor package with top or bottom side cooling and method for manufacturing the semiconductor package | — | 2021-10-12 |
| 11133281 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Chau Fatt Chiang, Wae Chet Yong | 2021-09-28 |
| 11101201 | Semiconductor package having leads with a negative standoff | Thomas Stoek, Dirk Ahlers | 2021-08-24 |
| 10796986 | Leadframe leads having fully plated end faces | Markus Dinkel | 2020-10-06 |
| 10770399 | Semiconductor package having a filled conductive cavity | Chee Yang Ng, Hock Siang Chua, Josef Maerz, Nurfarena Othman, Joseph Victor Soosai Prakasam +1 more | 2020-09-08 |
| 10147703 | Semiconductor package for multiphase circuitry device | Amirul Afiq Hud, Teck Sim Lee, Thomas Stoek, Lee Shuang Wang, Chooi Mei Chong +1 more | 2018-12-04 |
| 10121753 | Enhanced solder pad | Jens Oetjen | 2018-11-06 |
| 9385059 | Overmolded substrate-chip arrangement with heat sink | Peter Ossimitz, Juergen Schaefer, Liu Chen, Markus Dinkel | 2016-07-05 |
| 9087829 | Semiconductor arrangement | Andreas Meiser, Steffen Thiele | 2015-07-21 |
| 8704269 | Die package | Andreas Meiser | 2014-04-22 |