| 10090251 |
Semiconductor chip having a dense arrangement of contact terminals |
Gottfried Beer, Juergen Hoegerl, Andreas Munding |
2018-10-02 |
| 9871017 |
Multi-level chip interconnect |
Tobias Jacobs |
2018-01-16 |
| 9859251 |
Semiconductor device having a chip under package |
Gottfried Beer |
2018-01-02 |
| 9651630 |
Circuitry and method for monitoring a power supply of an electronic device |
Jens Barrenscheen, Roderick McConnell |
2017-05-16 |
| 9385059 |
Overmolded substrate-chip arrangement with heat sink |
Juergen Schaefer, Liu Chen, Markus Dinkel, Stefan Macheiner |
2016-07-05 |
| 9362187 |
Chip package having terminal pads of different form factors |
— |
2016-06-07 |
| 9299673 |
Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith |
Matthias von Daak, Dirk Hesidenz |
2016-03-29 |
| 9219031 |
Chip arrangement, and method for forming a chip arrangement |
Robert Bauer, Tobias Jacobs |
2015-12-22 |
| 9204543 |
Integrated IC package |
— |
2015-12-01 |
| 9082644 |
Method of manufacturing and testing a chip package |
Matthias von Daak, Gottfried Beer |
2015-07-14 |
| 8799704 |
Semiconductor memory component having a diverting circuit |
— |
2014-08-05 |
| 8779577 |
Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells |
Matthias Van Daak, Dirk Hesidenz |
2014-07-15 |
| 8399265 |
Device for releasably receiving a semiconductor chip |
— |
2013-03-19 |
| 7640469 |
Electronic element comprising an electronic circuit which is to be tested and test system arrangement which is used to test the electronic element |
Ralf Arnold |
2009-12-29 |
| 7560801 |
Rewiring substrate strip with several semiconductor component positions |
— |
2009-07-14 |
| 7501701 |
Rewiring substrate strip having a plurality of semiconductor component positions |
— |
2009-03-10 |
| 7154116 |
Rewiring substrate strip with a number of semiconductor component positions |
Gavin Gibson |
2006-12-26 |