PO

Peter Ossimitz

Infineon Technologies Ag: 17 patents #473 of 7,486Top 7%
Overall (All Time): #274,796 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10090251 Semiconductor chip having a dense arrangement of contact terminals Gottfried Beer, Juergen Hoegerl, Andreas Munding 2018-10-02
9871017 Multi-level chip interconnect Tobias Jacobs 2018-01-16
9859251 Semiconductor device having a chip under package Gottfried Beer 2018-01-02
9651630 Circuitry and method for monitoring a power supply of an electronic device Jens Barrenscheen, Roderick McConnell 2017-05-16
9385059 Overmolded substrate-chip arrangement with heat sink Juergen Schaefer, Liu Chen, Markus Dinkel, Stefan Macheiner 2016-07-05
9362187 Chip package having terminal pads of different form factors 2016-06-07
9299673 Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith Matthias von Daak, Dirk Hesidenz 2016-03-29
9219031 Chip arrangement, and method for forming a chip arrangement Robert Bauer, Tobias Jacobs 2015-12-22
9204543 Integrated IC package 2015-12-01
9082644 Method of manufacturing and testing a chip package Matthias von Daak, Gottfried Beer 2015-07-14
8799704 Semiconductor memory component having a diverting circuit 2014-08-05
8779577 Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells Matthias Van Daak, Dirk Hesidenz 2014-07-15
8399265 Device for releasably receiving a semiconductor chip 2013-03-19
7640469 Electronic element comprising an electronic circuit which is to be tested and test system arrangement which is used to test the electronic element Ralf Arnold 2009-12-29
7560801 Rewiring substrate strip with several semiconductor component positions 2009-07-14
7501701 Rewiring substrate strip having a plurality of semiconductor component positions 2009-03-10
7154116 Rewiring substrate strip with a number of semiconductor component positions Gavin Gibson 2006-12-26