Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469161 | Lead frame-based semiconductor package | Thorsten Scharf, Chan Lam Cha, Swee Kah Lee, Stefan Macheiner | 2022-10-11 |
| 8624372 | Semiconductor component comprising an interposer substrate | Jochen Thomas, Peter Weitz, Ingo Wennemuth | 2014-01-07 |
| 8592258 | Semiconductor package and method of attaching semiconductor dies to substrates | Denver Paul C. Castillo, Bryan Tan, Rodel Manalac, Kian Teng Eng, Pang Hup Ong +3 more | 2013-11-26 |
| 8072085 | Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same | Jochen Thomas | 2011-12-06 |
| 7851899 | Multi-chip ball grid array package and method of manufacture | Fung Leng Chen, Seong Kwang Kim, Wee Lim Cha, Yi-Sheng Anthony Sun, Jochen Thomas | 2010-12-14 |
| 7402911 | Multi-chip device and method for producing a multi-chip device | Jochen Thomas | 2008-07-22 |
| 7265441 | Stackable single package and stacked multi-chip assembly | Werner Reiss | 2007-09-04 |
| 7198979 | Method for manufacturing a stack arrangement of a memory module | Jochen Thomas, Ingo Wennemuth | 2007-04-03 |
| 6977427 | Electronic component having stacked semiconductor chips in parallel, and a method for producing the component | Jochen Thomas | 2005-12-20 |
| 6927484 | Stack arrangement of a memory module | Jochen Thomas | 2005-08-09 |
| 6894381 | Electronic device having a stack of semiconductor chips and method for the production thereof | Anton Legen, Jochen Thomas | 2005-05-17 |
| 6075358 | Device in a semiconductor manufacturing installation in particular for integrated circuits | Norbert Martin Haueis, Friedrich Wanninger, Georg Schlaffer, Alfred Schallert, Peter Eigenstetter +1 more | 2000-06-13 |