FW

Friedrich Wanninger

Infineon Technologies Ag: 2 patents #3,160 of 7,486Top 45%
SA Siemens Aktiengesellschaft: 1 patents #10,653 of 22,248Top 50%
📍 Regensburg, DE: #549 of 1,384 inventorsTop 40%
Overall (All Time): #1,587,072 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
7208827 Encasing arrangement for a semiconductor component Christian Hauser, Simon Muff, Jens Pohl 2007-04-24
6462407 Electronic device having a multiplicity of contact bumps Uta Gebauer, Thomas Münch 2002-10-08
6075358 Device in a semiconductor manufacturing installation in particular for integrated circuits Wolfgang Hetzel, Norbert Martin Haueis, Georg Schlaffer, Alfred Schallert, Peter Eigenstetter +1 more 2000-06-13