Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450642 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba | 2022-09-20 |
| 10896893 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba | 2021-01-19 |
| 10892247 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba | 2021-01-12 |
| 10777536 | Semiconductor package with air cavity | Chau Fatt Chiang, April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin +8 more | 2020-09-15 |
| 10615145 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba | 2020-04-07 |
| 10505255 | Radio frequency device packages and methods of formation thereof | Ashutosh Baheti, Saverio Trotta | 2019-12-10 |
| 9935065 | Radio frequency device packages and methods of formation thereof | Ashutosh Baheti, Saverio Trotta | 2018-04-03 |
| 8592258 | Semiconductor package and method of attaching semiconductor dies to substrates | Denver Paul C. Castillo, Bryan Tan, Rodel Manalac, Kian Teng Eng, Pang Hup Ong +3 more | 2013-11-26 |
| 7265441 | Stackable single package and stacked multi-chip assembly | Wolfgang Hetzel | 2007-09-04 |
| 5232891 | Process for the manufacture of a gauze for a catalytic converter and a gauze for a catalytic converter manufactured according thereto | Michael Hormann, Stefan Kotowski, David Francis Lupton, Friedhold Scholz, Bruno Streb +1 more | 1993-08-03 |