Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002724 | Power module with metal substrate | Raphael Hellwig, Olaf Hohlfeld, Martin Mayer, Ivan Nikitin | 2024-06-04 |
| 11450642 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Alexander Heinrich, Ralf Otremba, Werner Reiss | 2022-09-20 |
| 11404336 | Power module with metal substrate | Raphael Hellwig, Olaf Hohlfeld, Martin Mayer, Ivan Nikitin | 2022-08-02 |
| 10896893 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Alexander Heinrich, Ralf Otremba, Werner Reiss | 2021-01-19 |
| 10892247 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Alexander Heinrich, Ralf Otremba, Werner Reiss | 2021-01-12 |
| 10615145 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Alexander Heinrich, Ralf Otremba, Werner Reiss | 2020-04-07 |
| 10366946 | Connection member with bulk body and electrically and thermally conductive coating | Edmund Riedl, Thomas Horedt, Ali Mazloum-Nejadari | 2019-07-30 |
| 8703544 | Electronic component employing a layered frame | Heng Wan Hong | 2014-04-22 |
| 8125060 | Electronic component with layered frame | Heng Wan Hong | 2012-02-28 |
| 7875968 | Leadframe, semiconductor package and support lead for bonding with groundwires | Mohamad Yazid Bin WAGIMAN, Min Wee Low | 2011-01-25 |