Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7875968 | Leadframe, semiconductor package and support lead for bonding with groundwires | Wu Hu Li, Mohamad Yazid Bin WAGIMAN | 2011-01-25 |
| 7732259 | Non-leaded semiconductor package and a method to assemble the same | Tian Siang Yip | 2010-06-08 |