Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7851899 | Multi-chip ball grid array package and method of manufacture | Seong Kwang Kim, Wee Lim Cha, Yi-Sheng Anthony Sun, Wolfgang Hetzel, Jochen Thomas | 2010-12-14 |
| 6768646 | High density internal ball grid array integrated circuit package | Chee Kiang Yew, Pang Hup Ong | 2004-07-27 |