JT

Jochen Thomas

Infineon Technologies Ag: 16 patents #513 of 7,486Top 7%
QA Qimonda Ag: 2 patents #153 of 575Top 30%
Fraunhofer: 1 patents #1,798 of 4,748Top 40%
Overall (All Time): #240,066 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
8624372 Semiconductor component comprising an interposer substrate Wolfgang Hetzel, Peter Weitz, Ingo Wennemuth 2014-01-07
8072085 Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same Wolfgang Hetzel 2011-12-06
7948071 Integrated circuit with re-route layer and stacked die assembly Peter Weitz, Jurgen Grafe, Harry Hedler, Jens Pohl 2011-05-24
7851899 Multi-chip ball grid array package and method of manufacture Fung Leng Chen, Seong Kwang Kim, Wee Lim Cha, Yi-Sheng Anthony Sun, Wolfgang Hetzel 2010-12-14
7456505 Integrated circuit chip and integrated device Minka Gospodinova, Dominique Savignac 2008-11-25
7422930 Integrated circuit with re-route layer and stacked die assembly Peter Weitz, Jurgen Grafe, Harry Hedler, Jens Pohl 2008-09-09
7402911 Multi-chip device and method for producing a multi-chip device Wolfgang Hetzel 2008-07-22
7352057 Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module Jurgen Grafe, Sylke Ludewig, Peter Weitz 2008-04-01
7345363 Semiconductor device with a rewiring level and method for producing the same Minka Gospodinova-Daltcheva, Harry Huebert, Rajesh Subraya, Ingo Wennemuth 2008-03-18
7297574 Multi-chip device and method for producing a multi-chip device Olaf Schoenfeld 2007-11-20
7294910 Electronic component with multilayered rewiring plate and method for producing the same Ingo Wennemuth 2007-11-13
7253514 Self-supporting connecting element for a semiconductor chip Anton Legen, Ingo Wennemuth 2007-08-07
7198979 Method for manufacturing a stack arrangement of a memory module Wolfgang Hetzel, Ingo Wennemuth 2007-04-03
7023097 FBGA arrangement Juergen Grafe, Ingo Wennemuth, Minka Gospodinova-Daltcheva, Maksim Kuzmenka 2006-04-04
6977427 Electronic component having stacked semiconductor chips in parallel, and a method for producing the component Wolfgang Hetzel 2005-12-20
6927484 Stack arrangement of a memory module Wolfgang Hetzel 2005-08-09
6894381 Electronic device having a stack of semiconductor chips and method for the production thereof Wolfgang Hetzel, Anton Legen 2005-05-17
6768191 Electronic component with stacked electronic elements Ingo Wennemuth 2004-07-27
6536682 Actuator component for a microspray and its production process Ralf Schnupp 2003-03-25