Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869865 | Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof | Thomas Bemmerl, Edward Myers, Michael Stadler | 2024-01-09 |
| 11211356 | Power semiconductor package and method for fabricating a power semiconductor package | Wee Aun Jason Lim, Paul Armand Asentista Calo, Ting Soon Chin, Sanjay Kumar Murugan, Ying Pok Sam +1 more | 2021-12-28 |
| 11088105 | Semiconductor device and method for fabricating a semiconductor device | Thomas Bemmerl, Edward Myers, Michael Stadler | 2021-08-10 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Ralf Otremba, Markus Dinkel, Josef Hoeglauer, Klaus Schiess, Xaver Schloegel | 2020-06-30 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Amirul Afiq Hud, Josef Hoeglauer, Klaus Schiess, Lee Shuang Wang +3 more | 2019-02-12 |
| 10147703 | Semiconductor package for multiphase circuitry device | Stefan Macheiner, Amirul Afiq Hud, Teck Sim Lee, Thomas Stoek, Lee Shuang Wang +1 more | 2018-12-04 |
| 10037934 | Semiconductor chip package having contact pins at short side edges | Ralf Otremba, Raynold Talavera Corocotchia, Teck Sim Lee, Sanjay Kumar Murugan, Klaus Schiess +2 more | 2018-07-31 |
| 9806029 | Transistor arrangement with semiconductor chips between two substrates | Ralf Otremba, Josef Hoeglauer | 2017-10-31 |
| 9515060 | Multi-chip semiconductor power device | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel | 2016-12-06 |
| 9368435 | Electronic component | Ralf Otremba, Klaus Schiess, Dominic Maier | 2016-06-14 |
| 9041170 | Multi-level semiconductor package | Ralf Otremba, Josef Höglauer, Klaus Schiess | 2015-05-26 |
| 8975117 | Semiconductor device using diffusion soldering | Ralf Otremba, Fong Lim, Abdul Rahman Mohamed, Ida Fischbach, Xaver Schloegel +2 more | 2015-03-10 |
| 8853835 | Chip arrangements, a chip package and a method for manufacturing a chip arrangement | Ralf Otremba, Josef Hoeglauer, Gerhard Noebauer | 2014-10-07 |
| 8836101 | Multi-chip semiconductor packages and assembly thereof | Teck Sim Lee | 2014-09-16 |