Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11609180 | Emitter package for a photoacoustic sensor | Siyuan Qi, Joachim Eder, Christoph Glacer, Mark Pavier | 2023-03-21 |
| 11492249 | MEMS sensor, MEMS sensor system and method for producing a MEMS sensor system | David Tumpold | 2022-11-08 |
| 11279120 | Device and method for debonding a structure from a main surface region of a carrier | Alfred Sigi, Daniel Porwol | 2022-03-22 |
| 11211298 | System and method for a transducer in an EWLB package | Stephan Pindl, Daniel Lugauer, Alfons Dehe | 2021-12-28 |
| 11195787 | Semiconductor device including an antenna | Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Thomas Kilger +4 more | 2021-12-07 |
| 11040872 | Semiconductor module | Claus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke | 2021-06-22 |
| 10626012 | Semiconductor device including a cavity lid | Franz-Xaver Muehlbauer, Thomas Kilger | 2020-04-21 |
| 10600690 | Method for handling a product substrate and a bonded substrate system | Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Daniel Porwol +1 more | 2020-03-24 |
| 10549985 | Semiconductor package with a through port for sensor applications | Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger +5 more | 2020-02-04 |
| 10546752 | System and method for a transducer in an eWLB package | Stephan Pindl, Daniel Lugauer, Alfons Dehe | 2020-01-28 |
| 10435292 | Method for producing a semiconductor module | Claus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke | 2019-10-08 |
| 10186468 | System and method for a transducer in an eWLB package | Stephan Pindl, Daniel Lugauer, Alfons Dehe | 2019-01-22 |
| 10161908 | Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluid | Rui Miguel Moreira Araujo, Bernd Goller | 2018-12-25 |
| 10056295 | Method for handling a product substrate, a bonded substrate system and a temporary adhesive | Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Daniel Porwol +1 more | 2018-08-21 |
| 9988262 | Temporary mechanical stabilization of semiconductor cavities | Joachim Mahler, Daniel Porwol, Alfred Sigl | 2018-06-05 |
| 9981843 | Chip package and a method of producing the same | Alfons Dehe, Thomas Kilger, Markus Menath, Franz-Xaver Muehlbauer, Daniel Porwol +1 more | 2018-05-29 |
| 9806056 | Method of packaging integrated circuits | Ulrich Wachter, Thomas Kilger | 2017-10-31 |
| 9725303 | Semiconductor device including a MEMS die and a conductive layer | Franz-Xaver Muehlbauer, Thomas Kilger | 2017-08-08 |
| 9711462 | Package arrangement including external block comprising semiconductor material and electrically conductive plastic material | Gottfried Beer, Ulrich Wachter, Daniel Kehrer | 2017-07-18 |
| 9487392 | Method of packaging integrated circuits and a molded package | Ulrich Wachter, Thomas Kilger | 2016-11-08 |
| 9368435 | Electronic component | Ralf Otremba, Klaus Schiess, Chooi Mei Chong | 2016-06-14 |
| 9275878 | Metal redistribution layer for molded substrates | Ulrich Wachter, Thomas Kilger | 2016-03-01 |
| 9147585 | Method for fabricating a plurality of semiconductor devices | Thomas Kilger, Ulrich Wachter, Gottfried Beer | 2015-09-29 |
| 9099454 | Molded semiconductor package with backside die metallization | Ulrich Wachter, Veronika Huber, Thomas Kilger, Ralf Otremba, Bernd Stadler +3 more | 2015-08-04 |
| 8990744 | Electrical measurement based circuit wiring layout modification method and system | Gottfried Beer, Gerhard Metzger-Brückl, Rainer Leuschner | 2015-03-24 |