MS

Matthias Steiert

Infineon Technologies Ag: 11 patents #789 of 7,486Top 15%
MS Matrix Sensors: 2 patents #5 of 6Top 85%
📍 Ehrenkirchen, CA: #1 of 1 inventorsTop 100%
Overall (All Time): #316,786 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
11402556 Wafer level method for manufacturing integrated infrared (IR) emitter elements having an optical IR filter placed on the main surface region of the carrier substrate on which the IR emitter is formed Stephan Pindl 2022-08-02
11342298 Die stack arrangement comprising a die-attach-film tape and method for producing same Karolina Gierl 2022-05-24
10861818 Die stack arrangement comprising a die-attach-film tape and method for producing same Karolina Gierl 2020-12-08
10793429 Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly Christian Geissler, Karolina Zogal 2020-10-06
10616703 MEMS sound transducer element and method for producing a MEMS sound transducer element Horst Theuss 2020-04-07
10584028 Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly Christian Geissler, Karolina Zogal 2020-03-10
10549985 Semiconductor package with a through port for sensor applications Dominic Maier, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger +5 more 2020-02-04
10486961 Method for producing a MEMS sensor, and MEMS sensor 2019-11-26
10407437 Camptothecin derivatives and uses thereof Peter Langecker, Toshiaki Hino, Jan Scicinksi, Kumarapandian Paulvannan 2019-09-10
10377626 Apparatus with a high heat capacity and method for producing the same Bernd Goller 2019-08-13
10155657 Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening Kok Yau Chua, Chu Hua Goh, Woon Yau Lim, Christina Yeong 2018-12-18
10064855 Composite nanoparticles and uses thereof Peter Langecker, Toshiaki Hino, Jan Scicinksi, Kumarapandian Paulvannan 2018-09-04
9475691 Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device Kok Yau Chua, Sook Woon Chan, Chau Fatt Chiang, Stefan Martens, Kian Hong Yeo +3 more 2016-10-25
8733154 Liquid analysis using capacitative micromachined ultrasound transducers Michael D. Cable 2014-05-27
8424370 Liquid analysis using capacitative micromachined ultrasound transducers Michael D. Cable 2013-04-23