Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9475691 | Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device | Kok Yau Chua, Sook Woon Chan, Chau Fatt Chiang, Stefan Martens, Matthias Steiert +3 more | 2016-10-25 |