Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691687 | Module and method of manufacturing a module | Daniel Kehrer, Ulrich Krumbein, Beng Keh See, Horst Theuss, Helmut Wietschorke +1 more | 2017-06-27 |
| 9475691 | Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device | Kok Yau Chua, Sook Woon Chan, Chau Fatt Chiang, Matthias Steiert, Kian Hong Yeo +3 more | 2016-10-25 |
| 9312226 | Semiconductor device having an identification mark | Berthold Schuderer, Mathias Vaupel, Raimund Peichl | 2016-04-12 |
| 9099547 | Testing process for semiconductor devices | Mathias Vaupel | 2015-08-04 |
| 8883565 | Separation of semiconductor devices from a wafer carrier | Mathias Vaupel, Sebastian Bernrieder, Adolf Koller | 2014-11-11 |
| 8749056 | Module and method of manufacturing a module | Daniel Kehrer, Tze Yang Hin, Helmut Wietschorke, Horst Theuss, Beng Keh See +1 more | 2014-06-10 |
| 8558174 | Processing system | Holger Doemer, Walter Mack | 2013-10-15 |
| 8535983 | Method of manufacturing a semiconductor device | Tze Yang Hin, Werner Simbuerger, Helmut Wietschorke, Horst Theuss, Beng Keh See +1 more | 2013-09-17 |
| 8350227 | Processing system | Holger Doemer, Walter Mack | 2013-01-08 |
| 8115180 | Processing system | Holger Doemer, Walter Mack | 2012-02-14 |