Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2021-08-03 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller +5 more | 2020-02-04 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2019-08-27 |
| 9691687 | Module and method of manufacturing a module | Daniel Kehrer, Ulrich Krumbein, Horst Theuss, Helmut Wietschorke, Tze Yang Hin +1 more | 2017-06-27 |
| 9653405 | Chip arrangement and a method of manufacturing a chip arrangement | Horst Theuss | 2017-05-16 |
| 8749056 | Module and method of manufacturing a module | Daniel Kehrer, Stefan Martens, Tze Yang Hin, Helmut Wietschorke, Horst Theuss +1 more | 2014-06-10 |
| 8722462 | Semiconductor package | Klaus Elian, Horst Theuss | 2014-05-13 |
| 8535983 | Method of manufacturing a semiconductor device | Tze Yang Hin, Stefan Martens, Werner Simbuerger, Helmut Wietschorke, Horst Theuss +1 more | 2013-09-17 |
| 8053280 | Method of producing multiple semiconductor devices | Chau Fatt Chiang, Chwee Lan Lai | 2011-11-08 |