Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062589 | Semiconductor packages including recesses to contain solder | Adrian Lis | 2024-08-13 |
| 11040872 | Semiconductor module | Claus Waechter, Edward Fuergut, Bernd Goller, Dominic Maier | 2021-06-22 |
| 10923364 | Methods for producing packaged semiconductor devices | Kristina Mayer, Johannes Lodermeyer | 2021-02-16 |
| 10435292 | Method for producing a semiconductor module | Claus Waechter, Edward Fuergut, Bernd Goller, Dominic Maier | 2019-10-08 |
| 10361138 | Method for manufacturing an arrangement including a chip carrier notch | Edward Fuergut | 2019-07-23 |
| 10128165 | Package with vertically spaced partially encapsulated contact structures | Wolfram Hable, Andreas Grassmann, Juergen Hoegerl, Eduard Knauer | 2018-11-13 |
| 9698070 | Arrangement having a plurality of chips and a chip carrier, and a processing arrangement | Edward Fuergut | 2017-07-04 |
| 9202753 | Semiconductor devices and methods of producing these | Johann Kosub | 2015-12-01 |