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Power module having vertically aligned first and second substrates |
Ewald Guenther, Thomas Schmid |
2025-07-29 |
| 12334458 |
Package with pad having open notch |
— |
2025-06-17 |
| 12300643 |
Solder stop feature for electronic devices |
Ivan Nikitin, Peter Scherl, Achim Althaus |
2025-05-13 |
| 12224222 |
Semiconductor package having a thermally and electrically conductive spacer |
Christian Neugirg, Peter Scherl, Ewald Guenther |
2025-02-11 |
| 12183667 |
Semiconductor package with power electronics carrier having trench spacing adapted for delamination |
Peter Scherl, Christian Neugirg |
2024-12-31 |
| 12113000 |
Lead adapters for semiconductor package |
Ajay Pai, Tino Karczewski |
2024-10-08 |
| 12062589 |
Semiconductor packages including recesses to contain solder |
Michael Ledutke |
2024-08-13 |
