Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374661 | Power module having vertically aligned first and second substrates | Adrian Lis, Thomas Schmid | 2025-07-29 |
| 12224222 | Semiconductor package having a thermally and electrically conductive spacer | Christian Neugirg, Adrian Lis, Peter Scherl | 2025-02-11 |
| 9537070 | Optoelectronic component with a wireless contacting | Jörg Erich Sorg, Norbert Stath | 2017-01-03 |
| 8900894 | Method of producing a radiation-emitting optoelectronic component | Jörg Erich Sorg, Norbert Stath | 2014-12-02 |
| 8581279 | Light-emitting diode chip comprising a contact structure | Johannes Baur, Volker Harle, Berthold Hahn, Andreas Weimar, Raimund Oberschmid +3 more | 2013-11-12 |
| 8562142 | Projector for micro projection surfaces and use of a multicolour LED in a projector | Stefan Groetsch, Alexander Wilm, Siegfried Herrmann | 2013-10-22 |
| 8344360 | Organic electronic devices with an encapsulation | Mark Auch, Lim Shuang Fang, Chua Soo Jin, Low Bee Ling | 2013-01-01 |
| 7906352 | Chip and method for producing a chip | Herbert Brunner, Dieter Eissler, Helmut Fischer, Alexander Heindl | 2011-03-15 |
| 7510888 | LED arrangement | Gunter Waitl, Herbert Brunner, Jörg Strauss | 2009-03-31 |
| 7498737 | Method of manufacturing an organic electronic device and organic electronic device | Karsten Heuser, Georg Wittmann | 2009-03-03 |
| 7462878 | Light-emitting diode chip comprising a converter layer and method of making a light-emitting diode chip comprising a converter layer | Markus Richter, Franz Eberhard, Peter Holzer | 2008-12-09 |
| 7432533 | Encapsulation of electronic devices with shaped spacers | Mark Auch, Soo Jin Chua | 2008-10-07 |
| 7423375 | Encapsulation for electroluminescent devices | Hooi Bin Lim, Shi Chai Chong, David Lacey | 2008-09-09 |
| 7419842 | Encapsulation of electroluminescent devices with shaped spacers | Mark Auch, Soo Jin Chua | 2008-09-02 |
| 7394153 | Encapsulation of electronic devices | Mark Auch, Lim Shuang Fang, Chua Soo Jin | 2008-07-01 |
| 7329560 | Method for encapsulating at least one organic light-emitting (OLED) device and OLED device | Wolfgang Gramann | 2008-02-12 |
| 7262441 | Laminates for encapsulating devices | Wei-Jun Wang, Soo Jin Chua | 2007-08-28 |
| 7255823 | Encapsulation for oled devices | Mark Auch | 2007-08-14 |
| 7221093 | Patterning of electrodes in OLED devices | Mark Auch, Soo Jin Chua | 2007-05-22 |
| 7214570 | Encapsulating a device | — | 2007-05-08 |
| 7208769 | LED arrangement | Gunter Waitl, Herbert Brunner, Jörg Strauss | 2007-04-24 |
| 7166007 | Encapsulation of electronic devices | Mark Auch, Lim Shuang Fang, Chua Soo Jin | 2007-01-23 |
| 7148624 | Uniform deposition of organic layer | Hooi Bin Lim, Cheng Kooi Tan, Shi Chai Chong, Hagen Klausmann | 2006-12-12 |
| 7098591 | Transparent electrode material for quality enhancement of OLED devices | Furong Zhu, Soo Jin Chua | 2006-08-29 |
| 7057337 | Patterning of electrodes in OLED devices | — | 2006-06-06 |