Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239127 | Topside-cooled semiconductor package with molded standoff | Edward Myers, Liu Chen, Chee Chiew Chong, Wee Boon Tay | 2022-02-01 |
| 11211356 | Power semiconductor package and method for fabricating a power semiconductor package | Paul Armand Asentista Calo, Ting Soon Chin, Chooi Mei Chong, Sanjay Kumar Murugan, Ying Pok Sam +1 more | 2021-12-28 |