Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239127 | Topside-cooled semiconductor package with molded standoff | Edward Myers, Liu Chen, Wee Aun Jason Lim, Wee Boon Tay | 2022-02-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239127 | Topside-cooled semiconductor package with molded standoff | Edward Myers, Liu Chen, Wee Aun Jason Lim, Wee Boon Tay | 2022-02-01 |