Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080625 | Semiconductor package with releasable isolation layer protection | Li Fong Chong, Yee Beng Daryl Yeow, Chii Shang Hong, Hui Kin Lit | 2024-09-03 |
| 12057376 | Three level interconnect clip | Thai Kee Gan, Mark Pavier, Ke Yan Tean, Mohd Hasrul Zulkifli | 2024-08-06 |
| 11791238 | Semiconductor package with releasable isolation layer protection | Li Fong Chong, Yee Beng Daryl Yeow, Chii Shang Hong, Hui Kin Lit | 2023-10-17 |
| 11069600 | Semiconductor package with space efficient lead and die pad design | Ke Yan Tean, Thomas Bemmerl, Thai Kee Gan | 2021-07-20 |
| 10840172 | Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package | Thomas Bemmerl, Nurfarena Othman | 2020-11-17 |