Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205874 | Semiconductor package with wire bond joints | Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Mohd Afiz Hashim, Mei Fen Hiew | 2025-01-21 |
| 12068213 | Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof | Sanjay Kumar Murugan, Ralf Otremba | 2024-08-20 |
| 12057376 | Three level interconnect clip | Azlina Kassim, Mark Pavier, Ke Yan Tean, Mohd Hasrul Zulkifli | 2024-08-06 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Stefan Woetzel, Edward Fuergut, Chee Hong Lee, Jayaganasan Narayanasamy +1 more | 2024-05-14 |
| 11842953 | Semiconductor package with wire bond joints and related methods of manufacturing | Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Mohd Afiz Hashim, Mei Fen Hiew | 2023-12-12 |
| 11652078 | High voltage semiconductor package with pin fit leads | Edmund Sales Cabatbat, Kean Ming Koe, Ke Yan Tean | 2023-05-16 |
| 11417538 | Semiconductor package including leads of different lengths | Edmund Sales Cabatbat | 2022-08-16 |
| 11348866 | Package and lead frame design for enhanced creepage and clearance | Edward Fuergut, Teck Sim Lee, Lee Shuang Wang | 2022-05-31 |
| 11069600 | Semiconductor package with space efficient lead and die pad design | Ke Yan Tean, Thomas Bemmerl, Azlina Kassim | 2021-07-20 |
| 11011456 | Lead frames including lead posts in different planes | Lee Shuang Wang, Jo Ean Joanna Chye | 2021-05-18 |