Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266628 | Semiconductor package having a metal clip and related methods of manufacturing | Engku Izyan Munirah E Afandi, Wee Peng Chong | 2025-04-01 |
| 12205874 | Semiconductor package with wire bond joints | Mohd Kahar Bajuri, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew | 2025-01-21 |
| 11842953 | Semiconductor package with wire bond joints and related methods of manufacturing | Mohd Kahar Bajuri, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew | 2023-12-12 |