Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412797 | Hybrid embedded package | Chee Yang Ng | 2025-09-09 |
| 12283538 | Molded semiconductor package having an embedded inlay | Marcus Boehm, Michael Fuegl, Ludwig Heitzer | 2025-04-22 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Edward Fuergut, Thai Kee Gan, Chee Hong Lee, Jayaganasan Narayanasamy +1 more | 2024-05-14 |
| 11710684 | Package with separate substrate sections | Frank Singer, Martin Gruber, Thorsten Meyer, Thorsten Scharf, Peter Strobel | 2023-07-25 |
| 11676879 | Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier | Chee Yang Ng | 2023-06-13 |
| 11521907 | Hybrid embedded package | Chee Yang Ng | 2022-12-06 |