Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12405202 | Semiconductor device for particle measurement and method for operating the semiconductor device | Klaus Elian, Fabian Merbeler, Matthias Eberl, Thomas Muller, Andreas Allmeier +4 more | 2025-09-02 |
| 12283538 | Molded semiconductor package having an embedded inlay | Marcus Boehm, Michael Fuegl, Stefan Woetzel | 2025-04-22 |
| 12158448 | Radiation source device | Derek Debie, Klaus Elian, David Tumpold, Jens Pohl, Cyrus Ghahremani +3 more | 2024-12-03 |
| 10571682 | Tilted chip assembly for optical devices | Derek Debie, Klaus Elian, Cyrus Ghahremani, Johannes Lodermeyer, Oskar Neuhoff +1 more | 2020-02-25 |
| 10424819 | Semiconductor battery and semiconductor device including a semiconductor battery | Hans Ehm, Marko Lemke, Claudius Von Petersdorff-Campen | 2019-09-24 |
| 10043768 | Semiconductor device and method of manufacture thereof | Thorsten Meyer | 2018-08-07 |
| 9881909 | Method for attaching a semiconductor die to a carrier | Michael Bauer, Christian Stuempfl | 2018-01-30 |
| 9576935 | Method for fabricating a semiconductor package and semiconductor package | Michael Bauer, Christian Stuempfl | 2017-02-21 |
| 9030019 | Semiconductor device and method of manufacture thereof | Thorsten Meyer | 2015-05-12 |
| 8421226 | Device including an encapsulated semiconductor chip and manufacturing method thereof | Thorsten Meyer, Dominic Maier | 2013-04-16 |
| 8330260 | Electronic component of VQFN design and method for producing the same | Michael Bauer, Christian Stuempfl | 2012-12-11 |
| 8173488 | Electronic device and method of manufacturing same | Michael Bauer, Daniel Porwol | 2012-05-08 |
| 7919857 | Plastic housing and semiconductor component with said plastic housing | Michael Bauer, Peter Strobel, Jens Pohl, Christian Stuempfl | 2011-04-05 |
| 7834460 | Method for manufacturing an electronic component and corresponding electronic component | Michael Bauer, Christian Stuempfl | 2010-11-16 |
| 7749864 | Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip | Michael Bauer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2010-07-06 |
| 7714416 | Electronic circuit in a package-in-package configuration and production method | Michael Bauer, Christian Stuempfl | 2010-05-11 |
| 7683460 | Module with a shielding and/or heat dissipating element | Christian Stumpfl, Michael Bauer | 2010-03-23 |
| 7662664 | Electronic circuit in a package-on-package configuration and method for producing the same | Michael Bauer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2010-02-16 |
| 7592236 | Method for applying a structure of joining material to the back surfaces of semiconductor chips | Michael Bauer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2009-09-22 |
| 7547645 | Method for coating a structure comprising semiconductor chips | Michael Bauer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2009-06-16 |
| 7470601 | Semiconductor device with semiconductor chip and adhesive film and method for producing the same | Michael Bauer, Eric Kuerzel, Peter Strobel | 2008-12-30 |
| 7294916 | Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip | Michael Bauer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2007-11-13 |