Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283538 | Molded semiconductor package having an embedded inlay | Michael Fuegl, Ludwig Heitzer, Stefan Woetzel | 2025-04-22 |
| 12165959 | Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method | Frank Singer, Andreas Grassmann, Martin Gruber, Uwe Schindler | 2024-12-10 |
| 10781859 | Rolling-element bearing assembly | Jens Bergmann, Bo Han, Marco Hueter, Xiaobo Zhou, Thilo von Schleinitz | 2020-09-22 |
| 4947219 | Particulate semiconductor devices and methods | — | 1990-08-07 |