Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652078 | High voltage semiconductor package with pin fit leads | Thai Kee Gan, Kean Ming Koe, Ke Yan Tean | 2023-05-16 |
| 11417538 | Semiconductor package including leads of different lengths | Thai Kee Gan | 2022-08-16 |
| 10971436 | Multi-branch terminal for integrated circuit (IC) package | Thomas Stoek, Chii Shang Hong, Chiew Li Tai | 2021-04-06 |
| 10840164 | Wire bonded package with single piece exposed heat slug and leads | Chii Shang Hong, Lee Shuang Wang | 2020-11-17 |
| 10354943 | Multi-branch terminal for integrated circuit (IC) package | Thomas Stoek, Chii Shang Hong, Chiew Li Tai | 2019-07-16 |
| 10083899 | Semiconductor package with heat slug and rivet free die attach area | Mohd Kahar Bajuri, Gaylord Evangelista Cruz, Amirul Afiq Hud, Teck Sim Lee, Norbert Joson Santos +2 more | 2018-09-25 |
| 9048397 | Color yield of white LEDs | Lily Khor, Ho Tuck Ming | 2015-06-02 |