Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114367 | Molded integrated circuit packages and methods of forming the same | Phuah Kian Keung | 2021-09-07 |
| 10468319 | Low-profile electronic package | Yan Shan Ng | 2019-11-05 |
| 9935039 | Pre-molded integrated circuit packages | Lynn Simporios Guirit | 2018-04-03 |
| 9640517 | Stacked electronic packages | Thong Kai Choh, Oo Choo Yee | 2017-05-02 |
| 9048397 | Color yield of white LEDs | Edmund Sales Cabatbat, Ho Tuck Ming | 2015-06-02 |
| 8071470 | Wafer level package using stud bump coated with solder | Yong Lam Wai, Lau Choong Keong | 2011-12-06 |
| 7273767 | Method of manufacturing a cavity package | King Hoo Ong, Boon Pek Liew, Kai Choh Thong | 2007-09-25 |
| 6953711 | Flip chip on lead frame | Au Keng Yeun | 2005-10-11 |
| 6482680 | Flip-chip on lead frame | Ong King Hoo | 2002-11-19 |