Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114367 | Molded integrated circuit packages and methods of forming the same | Lily Khor | 2021-09-07 |
| 7786554 | Stress-free lead frame | Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Araventhan Eturajulu +3 more | 2010-08-31 |
| 7288833 | Stress-free lead frame | Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Araventhan Eturajulu +3 more | 2007-10-30 |
| 6867483 | Stress-free lead frame | Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Araventhan Eturajulu +3 more | 2005-03-15 |
| 6544817 | Method for sawing a moulded leadframe package | Lee Kock Huat, Chan Boon Meng, Lee Huan Sin, Cheong Mun Tuck | 2003-04-08 |