Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng-Fei Fu, Zhong Lu +7 more | 2017-09-26 |
| 9038264 | Non-uniform vacuum profile die attach tip | Pradeep Rai, Kim Lee Bock, Li-Ping Wang, JinXiang Huang, Enyong Tai +1 more | 2015-05-26 |
| 8499813 | System for separating a diced semiconductor die from a die attach tape | Jack Chang Chien, Weili Wang, Li-Ping Wang, XingZhi Liang, Shicai Ma | 2013-08-06 |
| 7745234 | Method for reclaiming semiconductor package | Robertito Piaduche, Ning Ye, Hem Takiar | 2010-06-29 |
| 7273767 | Method of manufacturing a cavity package | Lily Khor, Boon Pek Liew, Kai Choh Thong | 2007-09-25 |