Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908833 | Overlapping die stacks for nand package architecture | Hem Takiar, Li-Ping Wang, Hong Wan Ng | 2024-02-20 |
| 11309281 | Overlapping die stacks for NAND package architecture | Hem Takiar, Li-Ping Wang, Hong Wan Ng | 2022-04-19 |
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng-Fei Fu, Zhong Lu +7 more | 2017-09-26 |
| 9038264 | Non-uniform vacuum profile die attach tip | Pradeep Rai, Kim Lee Bock, Li-Ping Wang, JinXiang Huang, Jianhua Wang +1 more | 2015-05-26 |