Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830849 | Semiconductor device with unbalanced die stackup | Saurabh Nilkanth Athavale, Shrikar Bhagath | 2023-11-28 |
| 11552040 | Package process, DAF replacement | Siqi Zhang, Xu Wang, Shrikar Bhagath | 2023-01-10 |
| 10916878 | Unitary molded USB device | Tee Khoon Guan | 2021-02-09 |
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng-Fei Fu, Zhong Lu +7 more | 2017-09-26 |
| 9462694 | Spacer layer for embedding semiconductor die | Junrong Yan, Weili Wang, Li-Ping Wang, Xin Lu, Jianbin Gu +1 more | 2016-10-04 |
| 9038264 | Non-uniform vacuum profile die attach tip | Kim Lee Bock, Li-Ping Wang, JinXiang Huang, Enyong Tai, Jianhua Wang +1 more | 2015-05-26 |