LK

Lau Choong Keong

CB Carsem (M) Sdn. Bhd.: 1 patents #23 of 49Top 50%
Overall (All Time): #3,272,158 of 4,157,543Top 80%
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Patent #TitleCo-InventorsDate
8071470 Wafer level package using stud bump coated with solder Lily Khor, Yong Lam Wai 2011-12-06