Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8674488 | Light emitting diode (LED) packages | Chan Boon Meng, Phang Hon Keat | 2014-03-18 |
| 8535988 | Large panel leadframe | Chan Boon Meng, Phang Hon Keat | 2013-09-17 |
| 8394675 | Manufacturing light emitting diode (LED) packages | Chan Boon Meng, Phang Hon Keat | 2013-03-12 |
| 8314479 | Leadframe package with recessed cavity for LED | Chan Boon Meng, Phang Hon Keat | 2012-11-20 |
| 8071470 | Wafer level package using stud bump coated with solder | Lily Khor, Lau Choong Keong | 2011-12-06 |