Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756917 | Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device | Carsten von Koblinski, Daniel Pedone, Matteo Piccin, Roland Rupp, Jia Yi Wong | 2023-09-12 |
| 11075185 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Ivan Nikitin, Wei Han Koo | 2021-07-27 |
| 10978380 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Wei Han Koo | 2021-04-13 |
| 10971436 | Multi-branch terminal for integrated circuit (IC) package | Thomas Stoek, Chii Shang Hong, Edmund Sales Cabatbat | 2021-04-06 |
| 10431526 | Rivetless lead fastening for a semiconductor package | Kar Meng Ho, Jia Yi Wong, Sanjay Kumar Murugan | 2019-10-01 |
| 10354943 | Multi-branch terminal for integrated circuit (IC) package | Thomas Stoek, Chii Shang Hong, Edmund Sales Cabatbat | 2019-07-16 |
| 10083899 | Semiconductor package with heat slug and rivet free die attach area | Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Amirul Afiq Hud, Teck Sim Lee +2 more | 2018-09-25 |