Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756917 | Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device | Carsten von Koblinski, Daniel Pedone, Matteo Piccin, Roland Rupp, Chiew Li Tai | 2023-09-12 |
| 11217529 | Semiconductor device and method of forming a semiconductor device | Stefan Beyer, Marius Aurel Bodea | 2022-01-04 |
| 11107754 | Electronic device, leadframe for an electronic device and method for fabricating an electronic device and a leadframe | Kar Meng Ho | 2021-08-31 |
| 10727151 | Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package | Liu Chen, Teck Sim Lee, Wei Han Koo, Thomas Stoeck, Gilles Delarozee | 2020-07-28 |
| 10431526 | Rivetless lead fastening for a semiconductor package | Kar Meng Ho, Chiew Li Tai, Sanjay Kumar Murugan | 2019-10-01 |
| 8877617 | Methods and structures for forming and protecting thin films on substrates | Thomas Qiu | 2014-11-04 |