Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Chan Lam Cha, Thorsten Meyer, Klaus Schiess, Guan Choon Matthew Nelson Tee | 2021-08-03 |
| 11075185 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Ivan Nikitin, Chiew Li Tai | 2021-07-27 |
| 10978380 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Chiew Li Tai | 2021-04-13 |
| 10727151 | Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package | Liu Chen, Teck Sim Lee, Jia Yi Wong, Thomas Stoeck, Gilles Delarozee | 2020-07-28 |
| 10396018 | Multi-phase half bridge driver package and methods of manufacture | Chau Fatt Chiang, Chan Lam Cha, Andreas Kucher, Theng Chao Long | 2019-08-27 |