Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2021-08-03 |
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Chan Lam Cha, Wei Han Koo, Thorsten Meyer, Klaus Schiess | 2021-08-03 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2019-08-27 |
| 8116102 | Integrated circuit device and method of producing | Chee Peng Wong, Tiam Sen Ong | 2012-02-14 |