Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957633 | Semiconductor device packaging assembly, lead frame strip and unit lead frame with trenches or grooves for guiding liquefied molding material | Boon Teik Tee | 2021-03-23 |
| 10438870 | Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channels | Boon Teik Tee | 2019-10-08 |
| 9659843 | Lead frame strip with molding compound channels | Boon Teik Tee | 2017-05-23 |
| 8116102 | Integrated circuit device and method of producing | Chee Peng Wong, Guan Choon Matthew Nelson Tee | 2012-02-14 |