Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957633 | Semiconductor device packaging assembly, lead frame strip and unit lead frame with trenches or grooves for guiding liquefied molding material | Tiam Sen Ong | 2021-03-23 |
| 10438870 | Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channels | Tiam Sen Ong | 2019-10-08 |
| 9659843 | Lead frame strip with molding compound channels | Tiam Sen Ong | 2017-05-23 |