Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094807 | Stacked transistor chip package with source coupling | Sergey Yuferev, Paul Armand Asentista Calo, Josef Maerz, Chee Yang Ng, Petteri Palm +1 more | 2024-09-17 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye +4 more | 2022-03-15 |
| 10396018 | Multi-phase half bridge driver package and methods of manufacture | Chau Fatt Chiang, Chan Lam Cha, Wei Han Koo, Andreas Kucher | 2019-08-27 |
| 9892991 | Connectable package extender for semiconductor device package | Tian San Tan, Ming Kai Benny Goh | 2018-02-13 |
| 9837380 | Semiconductor device having multiple contact clips | Tian San Tan | 2017-12-05 |
| 9666557 | Small footprint semiconductor package | Tian San Tan | 2017-05-30 |
| 9655265 | Electronic module | Tiam Meng Pon | 2017-05-16 |
| 9594111 | Turret handlers and methods of operations thereof | Nee Wan Khoo | 2017-03-14 |
| 9508625 | Semiconductor die package with multiple mounting configurations | Tian San Tan | 2016-11-29 |
| 9490199 | Interposer with programmable matrix for realizing configurable vertical semiconductor package arrangements | Tian San Tan, Wan Yee Ng, Kong Sin Chong | 2016-11-08 |
| 9484280 | Semiconductor device and method of manufacturing a semiconductor device | Tiam Meng Pon, Tian San Tan | 2016-11-01 |
| 9153518 | Molded semiconductor package with pluggable lead | Tian San Tan, Teck Siang Hee | 2015-10-06 |