Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9892991 | Connectable package extender for semiconductor device package | Theng Chao Long, Ming Kai Benny Goh | 2018-02-13 |
| 9837380 | Semiconductor device having multiple contact clips | Theng Chao Long | 2017-12-05 |
| 9666557 | Small footprint semiconductor package | Theng Chao Long | 2017-05-30 |
| 9508625 | Semiconductor die package with multiple mounting configurations | Theng Chao Long | 2016-11-29 |
| 9490199 | Interposer with programmable matrix for realizing configurable vertical semiconductor package arrangements | Theng Chao Long, Wan Yee Ng, Kong Sin Chong | 2016-11-08 |
| 9484280 | Semiconductor device and method of manufacturing a semiconductor device | Tiam Meng Pon, Theng Chao Long | 2016-11-01 |
| 9252063 | Extended contact area for leadframe strip testing | Nee Wan Khoo, Lay Yeap Lim | 2016-02-02 |
| 9153518 | Molded semiconductor package with pluggable lead | Theng Chao Long, Teck Siang Hee | 2015-10-06 |