Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727151 | Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package | Liu Chen, Teck Sim Lee, Jia Yi Wong, Wei Han Koo, Thomas Stoeck | 2020-07-28 |
| 10319671 | Semiconductor package with leadframe | Dirk Ahlers, Daniel Schleisser, Christopher Spielman, Thomas Stoek | 2019-06-11 |
| 9978672 | Transistor package with terminals coupled via chip carrier | Dirk Ahlers, Daniel Schleisser, Christopher Spielman, Thomas Stoek | 2018-05-22 |
| 8120161 | Semiconductor module including semiconductor chips coupled to external contact elements | Ralf Otremba, Lutz Goergens, Gerhard Noebauer, Tien Lai Tan, Erwin Huber +2 more | 2012-02-21 |