Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777536 | Semiconductor package with air cavity | Chau Fatt Chiang, April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin +8 more | 2020-09-15 |
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Sook Woon Chan, Chau Fatt Chiang, Khar Foong Chung, Chee Hong Fang, Muhammat Sanusi Muhammad +4 more | 2019-11-26 |
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2019-10-01 |
| 9806043 | Method of manufacturing molded semiconductor packages having an optical inspection feature | Swee Kah Lee, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2017-10-31 |