Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Hock Heng Chong, Sook Woon Chan, Chau Fatt Chiang, Khar Foong Chung, Muhammat Sanusi Muhammad +4 more | 2019-11-26 |
| 10099411 | Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips | Choon Huey Wang, Chau Fatt Chiang, Swee Kah Lee | 2018-10-16 |
| 9219025 | Molded flip-clip semiconductor package | Swee Kah Lee, Mei Chin Ng | 2015-12-22 |