Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300559 | Semiconductor packages and methods for manufacturing thereof | Si Hao Vincent Yeo, Chan Lam Cha, Ying Dieh Cheong, Chau Fatt Chiang, Cher Hau Danny Koh +7 more | 2025-05-13 |
| 12278171 | Chip package and method of forming a chip package | Chan Lam Cha, Hoe Jian Chong, Chin Kee Leow | 2025-04-15 |
| 12176222 | Semiconductor package with metal posts from structured leadframe | Chau Fatt Chiang, Thorsten Meyer, Chan Lam Cha, Chee Hong Lee, Swee Kah Lee +2 more | 2024-12-24 |
| 10937744 | Semiconductor packages including roughening features | Sock Chien Tey, Si Hao Vincent Yeo | 2021-03-02 |