Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278171 | Chip package and method of forming a chip package | Chan Lam Cha, Wern Ken Daryl Wee, Chin Kee Leow | 2025-04-15 |
| 11217511 | Quad package with conductive clips connected to terminals at upper surface of semiconductor die | Sock Chien Tey, Chan Lam Cha, Cher Hau Danny Koh, Kim Guan Tan, Mei Yong Wang | 2022-01-04 |