Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300559 | Semiconductor packages and methods for manufacturing thereof | Si Hao Vincent Yeo, Chan Lam Cha, Ying Dieh Cheong, Chau Fatt Chiang, Wern Ken Daryl Wee +7 more | 2025-05-13 |
| 11296000 | Formation of conductive connection tracks in package mold body using electroless plating | Norliza Morban, Yong Chern Poh, Khay Chwan Saw, Si Hao Vincent Yeo | 2022-04-05 |
| 11217511 | Quad package with conductive clips connected to terminals at upper surface of semiconductor die | Sock Chien Tey, Chan Lam Cha, Hoe Jian Chong, Kim Guan Tan, Mei Yong Wang | 2022-01-04 |
| 10741466 | Formation of conductive connection tracks in package mold body using electroless plating | Norliza Morban, Yong Chern Poh, Khay Chwan Saw, Si Hao Vincent Yeo | 2020-08-11 |
| 10325837 | Molded semiconductor package with C-wing and gull-wing leads | Hai Sin Chong, Stefan Machiener, Yong Chern Poh, Toni Salminen, Khay Chwan Saw | 2019-06-18 |