Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300559 | Semiconductor packages and methods for manufacturing thereof | Si Hao Vincent Yeo, Chan Lam Cha, Ying Dieh Cheong, Chau Fatt Chiang, Cher Hau Danny Koh +7 more | 2025-05-13 |
| 12176222 | Semiconductor package with metal posts from structured leadframe | Chau Fatt Chiang, Thorsten Meyer, Chan Lam Cha, Wern Ken Daryl Wee, Chee Hong Lee +2 more | 2024-12-24 |
| 12021000 | Semiconductor package and method for fabricating a semiconductor package | Khay Chwan Saw, Chau Fatt Chiang | 2024-06-25 |
| 11296000 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Yong Chern Poh, Khay Chwan Saw, Si Hao Vincent Yeo | 2022-04-05 |
| 11152288 | Lead frames for semiconductor packages | Eric Lopez Bonifacio, Thorsten Hinderer, Fortunato Lopez | 2021-10-19 |
| 10741466 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Yong Chern Poh, Khay Chwan Saw, Si Hao Vincent Yeo | 2020-08-11 |
| 9252089 | Universal lead frame for flat no-leads packages | Chee Hoe Mak, Ryan Ross Agbay Alinea, Yun Yann Ng | 2016-02-02 |